HDI回路基板とは

HDI回路基板は、HighDensityInterconnectorの英語の略語です。 高密度相互接続（HDI）製造は、プリント回路基板業界で最も急速に成長している分野の1つです。

製品説明

HDI is the English abbreviation of High Density Interconnector, and high-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From HP's first 32-bit computer in 1985, to today's large client servers with 36 sequentially laminated multi-layer printed boards and stacked micro-vias, HDI/micro-via technology is undoubtedly the PCB architecture of the future. Larger ASICs and FPGAs with smaller device pitches, more I/O pins, and embedded passives have increasingly shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, driving demand for Strong demand for HDI/micro vias. HDI process

最初の-注文プロセス：1 + N + 1

2番目の-注文プロセス：2 + N + 2

3つの-段階のプロセス：3 + N + 3

4番目の-レベルのプロセス：4 + N + 4