多層プリント基板の現状と開発

Since the middle and late 1980s, the output value and output of multi-layer boards have increased by more than 10 percent (compared with the previous year) every year. Due to the rapid development of components to "light, thin, short and small", Multilayer boards are bound to become the most influential and vital category in the printed circuit board industry, and become the leading product. Multilayer board structures will be diversified, thin and high-rise, and MCM-L structure will be faster Development. Multi-layer boards require high investment in equipment and technology. In the future, high-level multi-layer boards will be developed and produced in large PCB factories with strong strength

今後のマルチ-レイヤーボードの開発動向：

高密度

薄いマルチ（高）層化

多層基板構造の多様化

高性能薄銅箔用薄肉基材

高い表面平坦性と表面コーティング技術

フレキシブルマルチレイヤーボードとリジッド-フレックスマルチレイヤーボード